![]() ![]() Furthermore, the rising R&D activities and the adoption of innovative technologies by the semiconductor packaging industry, will also drive the growth of the Wire Wedge Bonder Equipment market in this end-user segment. The need to increase production capacity and the need to adhere to the constant technological innovation in packaging techniques will be the major factors fueling market growth. In 2016, IDMs held the maximum market shares during 2016 and this segment is projected to continue its market dominance during the forecasted period as well. ![]() IDMs are working on expanding into the assembly business, while the OSATs are trying to make use of this opportunity to raise the profit margins. The packaging market has a huge potential and provides several growth opportunities to IDMs and OSATs. The shift in semiconductor packaging towards 3D IC technology will intensify the competition between the IDMs and OSATs. The Wire Wedge Bonder Equipment market is a part of the overall semiconductor packaging and assembly equipment market. ![]() The capillary then settles over the area that need A wire is passed through the wedge tool over the microchip. Wedge bonding works by using a wedge bonder. Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. ![]()
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May 2023
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